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Thread: Other pad frame options

11 Discord messages from ℹ️ - Information/⁉️-questions/threads/other-pad-frame-options.md.

Category: ℹ️ - Information Parent channel: #⁉️-questions Thread ID: 1488312585055899648

Messages: 11

message-1488312585055899648

2026-03-30T23:02:51.788+00:00 — Matt G. (Mobius) (@mguthaus)

Content

The wafer.space site shows a number of different pad frame configurations. However, the template project only comes with one per slot size. Where do we get the others or how do we generate them?

For the CoB bonding, what will be done with other pad frames? Will they all just have the IOs bonded out to pads? Or do you have to use one of the default slots?
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message-1488639709532917952

2026-03-31T20:42:44.341+00:00 — Matt G. (Mobius) (@mguthaus)

Content

@Tim 'mithro' Ansell @Leo Moser (mole99) Do you have an answer to this?
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message-1488651495401455839

2026-03-31T21:29:34.311+00:00 — tnt (@246tnt)

Content

The main website states the default pad ring is required for CoB add on.
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message-1488651573893664990

2026-03-31T21:29:53.025+00:00 — tnt (@246tnt)

Content

"""†Default pad ring I/O count. The default pad ring is only required if you purchase the Chip on Board packaging add-on."""

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message-1488699441211768944

2026-04-01T00:40:05.483+00:00 — Tim 'mithro' Ansell (@mithro_)

Content

@Matt G. (Mobius) - As @tnt says, you need to use the default pad ring if you want the CoB add-on, otherwise you are free to do what ever you want.
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message-1488938039182098543

2026-04-01T16:28:11.672+00:00 — Matt G. (Mobius) (@mguthaus)

Content

Ok. What about the first part of the question? How do we generate the other pad frames? Will we have to add our own slot configurations etc?
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message-1488939433964081242

2026-04-01T16:33:44.214+00:00 — Matt G. (Mobius) (@mguthaus)

Content

Was there a reason that we didn't use the max IO option for the CoB? It doesn't change the core area.
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message-1488939829579350278

2026-04-01T16:35:18.536+00:00 — tnt (@246tnt)

Content

The COB cost is per-bond-wire, more bond wire is more expensive.
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message-1488962080169267451

2026-04-01T18:03:43.49+00:00 — Leo Moser (mole99) (@mole99)

Content

If you go for the 1x1 slot, you can simply change the `PAD_*` variables in this config: https://github.com/wafer-space/gf180mcu-project-template/blob/main/librelane/slots/slot_1x1.yaml
However, you must ensure that the pad instances you are referencing exist in the RTL: https://github.com/wafer-space/gf180mcu-project-template/blob/main/src/chip_top.sv

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message-1489422050883014727

2026-04-03T00:31:29.054+00:00 — Tim 'mithro' Ansell (@mithro_)

Content

Some IO configuration experiments are displayed at https://mithro.github.io/gf180mcu-project-template/
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message-1489422242952511549

2026-04-03T00:32:14.847+00:00 — Tim 'mithro' Ansell (@mithro_)

Content

@Matt G. (Mobius) - As tnt said, the cost is a few cents per wire-bond, so too many IOs makes it more than the $1.50 USD budget
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