Category: ℹ️ - Information
Parent channel: #⁉️-questions
Thread ID: 1444531273728262376
Messages: 31
message-1444531273728262376
2025-11-30T03:31:33.75+00:00 — Buck (@buck_042)
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Content
When I use LibreLane to generate a small digital module, everything looks normal but there is no metal fill, whereas I noticed that the top design in the template does have metal fill. What is causing this difference?
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</details>message-1444535127051862158
2025-11-30T03:46:52.454+00:00 — Marcus (@bigturtle8)
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Content
First thought would be different hardening strategies in the config.json, but could be wrong (https://librelane.readthedocs.io/en/latest/usage/caravel/index.html)
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</details>message-1444536417509183488
2025-11-30T03:52:00.123+00:00 — Buck (@buck_042)
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Content
I don't know, I don't see any configuration related to metal fill in template's config.yaml. And the fillers are successfully inserted, but no metal fill.
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</details>message-1444552932862329045
2025-11-30T04:57:37.69+00:00 — Buck (@buck_042)
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Content
I see, the template uses the chip flow, which calls some KLayout scripts to insert metal fill. In my case, I didn’t explicitly set any flow, so I assume it’s using the default classic flow, which doesn’t seem to run the KLayout density/metal-fill steps.
If I want to add metal fill for a small standalone digital block, what is the recommended approach?
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2025-11-30T07:35:37.897+00:00 — Leo Moser (mole99) (@mole99)
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Content
Normally, you wouldn't run metal fill for a standalone block.
One way to do that, however, is to add the `KLayout.Filler` step after one the StreamOut steps in the Classic flow. You can do this directly in the config.
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2025-11-30T07:48:54.129+00:00 — Buck (@buck_042)
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Content
Thanks! May I ask how to do that directly in the config?
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2025-11-30T09:37:03.907+00:00 — Leo Moser (mole99) (@mole99)
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Content
You can find the relevant docs here: https://librelane.readthedocs.io/en/latest/usage/writing_custom_flows.html
By using `substituting_steps` and placing a "+" before the step ID. You're welcome!
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2025-11-30T17:26:53.939+00:00 — Buck (@buck_042)
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Content
Thank you!
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2025-12-01T05:30:37.121+00:00 — Buck (@buck_042)
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Content
@Leo Moser (mole99) Hi mole99, may I ask a further question? Can I ask why only this much metal is filled here? It seems the density requirement is still not met. Is this normal? Thank you very much!
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2025-12-01T06:06:23.923+00:00 — Leo Moser (mole99) (@mole99)
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Content
The filler generation script was made to fill an entire chip, so it adheres to rules such as leaving a 26um spacing from the edges to meet the 10um distance to the sealring etc.
I assume this is what leads to what we see here.
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2025-12-01T06:29:57.846+00:00 — Buck (@buck_042)
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Content
I see, thanks! I think this works. We do this because we will integrate this module to our analog module.
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2025-12-01T06:49:25.867+00:00 — Buck (@buck_042)
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Content
Oh I see, actually we don't need fill the digital module at this stage, like we can fill all during the top level?
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2025-12-01T07:34:05.733+00:00 — Leo Moser (mole99) (@mole99)
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Yes, that is the usual approach. The fill for the entire chip is added at the end.
If you do an analog top-level integration you can add the fill manually:
```
klayout -b -zz -r ${PDK_ROOT}/${PDK}/libs.tech/klayout/tech/drc/filler_generation/fill_all.rb -rd input=chip_top.gds -rd output=chip_top_filled.gds
```
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2025-12-01T15:13:35.165+00:00 — Buck (@buck_042)
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Hi Leo, thank you! If we want to do top-level integration, may I ask how to obtain a clean pad ring without any logic cells? My current idea is to follow the template, remove everything in the Verilog except VDD/VSS and the pad instances, and remove the metal fill step in the flow, and then rerun the synthesis and PnR flow. Is this the correct approach?
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2025-12-01T15:17:06.836+00:00 — Leo Moser (mole99) (@mole99)
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There is an easier approach :)
You customize the flow to only generate the padring + sealring and then streamout the GDS. I already did this for the MOSbius group: https://github.com/wafer-space/gf180mcu-project-template/pull/29
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2025-12-01T15:26:59.857+00:00 — Buck (@buck_042)
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Thank you, this is very helpful! So with this, can we still configure our IO plan? Like, by changing the pad instances in Verilog and the IO placement inside the config.yaml.
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2025-12-01T15:29:36.774+00:00 — Leo Moser (mole99) (@mole99)
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Yes, it still uses the LibreLane configuration. It simply rearranges the flow slightly.
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2025-12-01T15:30:12.208+00:00 — Leo Moser (mole99) (@mole99)
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There were XOR errors between magic and KLayout (?) but I haven't had the time to look into it. Maybe you could see what the difference between the two layouts is.
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2025-12-01T15:34:03.093+00:00 — Buck (@buck_042)
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Thank you, this is helpful!
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2025-12-01T15:36:21.158+00:00 — Buck (@buck_042)
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I will try to do that. But to be honest, we are trying to catch up with the DDL now. 😂 See what we can help. Really thank you, Leo!
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2025-12-01T15:37:41.383+00:00 — Leo Moser (mole99) (@mole99)
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Yes, just make sure to use the correct layout then if there is a difference between magic and KLayout 😁
No worries! Looking forward to your design.
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2025-12-01T22:17:35.927+00:00 — Evansika (@xintingjiang_36756)
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I also encountered this when generating the empty pad frame today. Now I am looking into the differences between the two layouts
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2025-12-01T22:43:43.751+00:00 — Evansika (@xintingjiang_36756)
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In my case, klayout gds is correct because I found that the only mismatch is that the magic gds has these extract tieh and tiel cells at the origin and I don't know why
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2025-12-02T07:34:30.541+00:00 — Leo Moser (mole99) (@mole99)
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Right, that's the difference! It seems that magic exports the instances even if they were not placed. There are some constants that are used in `chip_top`, but we stream out the padring before any of those stdcells can be placed and routed.
So the KLayout version is the correct one to use.
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2025-12-03T15:26:49.854+00:00 — Buck (@buck_042)
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Hi Leo, may I ask a question? We are doing analog top-level integration now, so after we connect our design to the pad ring, is this the last step before DRC and LVS? Or any other step we should run? Thank you!
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2025-12-03T15:29:08.139+00:00 — Leo Moser (mole99) (@mole99)
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Hi Buck, sure thing. You should also generate the fill before doing DRC and LVS, but other than that, that should be it.
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2025-12-03T15:30:42+00:00 — Buck (@buck_042)
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Thanks!
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2025-12-09T02:19:23.674+00:00 — Buck (@buck_042)
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- User name: buck_042
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Content
@Leo Moser (mole99) Hi Leo, sorry to bother you again, after we do the top level analog style integration and do the fill step, is there any script or command that we can use to tun the drc check in librelane environment? Before we used chipathon environment. Thanks!
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2025-12-09T06:23:15.788+00:00 — tnt (@246tnt)
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596068704471482370 - Nickname: tnt
- User name: 246tnt
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Content
If you run the pre-check, it will run DRC.
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2025-12-09T07:24:20.558+00:00 — Leo Moser (mole99) (@mole99)
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Content
As Sylvain said, you can run the precheck.
This can be done either through the online platform (https://platform.wafer.space/) or locally (https://github.com/wafer-space/gf180mcu-precheck).
Alternatively, you can run the DRC deck directly: https://github.com/wafer-space/gf180mcu/blob/main/gf180mcuD/libs.tech/klayout/tech/drc/gf180mcu.drc
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2025-12-09T19:03:29.047+00:00 — Buck (@buck_042)
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Thanks!
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