Thread: gf180mcu-project-template-librelane-conf

3 Discord messages from 📐 - Designing/📦-cob/threads/gf180mcu-project-template.md.

Category: 📐 - Designing Parent channel: #📦-cob Thread ID: 1431949282944221267

Messages: 3

message-1432270296458596472

2025-10-27T07:30:48.971+00:00 — Leo Moser (mole99) (@mole99)

Message ID: 1432270296458596472
Author ID: 323371864074485771
Nickname: Leo Moser (mole99)
User name: mole99
Type: 21
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message-1432270303668604948

2025-10-27T07:30:50.69+00:00 — Leo Moser (mole99) (@mole99)

Message ID: 1432270303668604948
Author ID: 323371864074485771
Nickname: Leo Moser (mole99)
User name: mole99
Type: Default
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Content

The mapping happens in the config.yaml through the `PAD_SOUTH`, `PAD_EAST`, `PAD_NORTH` and `PAD_WEST` variables. However, [chip_top.sv](https://github.com/wafer-space/gf180mcu-project-template/blob/main/src/chip_top.sv) also needs to be changed to instantiate more or fewer pads.

You could do a 50pin mezzanine using the same 74pad padring. Simply ignore the pads that shouldn't be used. If you adjust the padring, we need to pay a second bonding setup fee. And, as you mentioned, we need more files in the template, which could confuse people.

A new bonding setup would probably only make sense if we have a new die size.

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message-1432275466844373042

2025-10-27T07:51:21.687+00:00 — Andrew Wingate (@anfroholic)

Message ID: 1432275466844373042
Author ID: 756011607603019777
Nickname: Andrew Wingate
User name: anfroholic
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Thank you! That's what I basically figured. This also kindof works the best because the wirebonding frame and everything else can remain the same/very similar.

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